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Home → Türkiye → Additively Manufactured Electronics


Additively Manufactured Electronics

High fidelity active electronic and electromechanical subassemblies are integral enablers of autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. They necessitate iterative development, IP safety, fast time-to-market and device performance gains, thereby mandating AME for in-house, rapid prototyping and production.

Nano Dimension machines serve cross-industry needs by depositing proprietary consumable conductive and dielectric materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, and transformers and electromechanical components, to function at unprecedented performance. Those turn-key systems bridge the gap between PCB and semiconductor Integrated Circuits.

A revolution at the click of a button: From CAD to a functional high- performance AME device in hours, solely at the cost of the consumable materials.

DragonFly IV

Build, Test, and Iterate Electronics in a Single Day!

A multi-material, multi-layer 3D printer that generates entire circuits in one step — including substrate, conductive traces, and passive components.

Design Flexibility Beyond Traditional Boundaries

A completely new way to build electronics.

Freedom in Three Dimensions

Layouts can now make connections in any 3D direction.

Novel Form Factors

FLIGHT software allows for new shapes in electro-mechanical CAD.


3D Data Preparation

Turn your PCB into any 3D geometry.


Design Verification

Verify your 3D design manufacturability.

FLIGHT Control

Print Preparation

Optimize your AME process.

Pair with our FLIGHT software



1,400mm x 800mm x 1,800mm


520kg (1,150lbs)

Power Supply

230VAC, 20A, 50-60Hz

Network Connectivity

Ethernet TCP/IP 10/100/1000

Operational Humidity

Above 35% non-condensing

Operational Temperature

Between 18°C (64°F) - 28°C (82°F)

Regulatory Compliance


Deposition Technology

Piezo drop-on-demand inkjet

Number of Printheads

2, one for each ink: conductive and dielectric


FLIGHT Software Suite (Design, Verification, Pre-Production)


Build Volume

160mm x 160mm x 3mm


Optimised silver nano particles and dielectric inks

Supported File Formats

All major ECAD and MCAD software, ODB++, Gerber & Excellon, STL


18 µm (x), 18 µm (y), 10 µm (z)

Min. Line/Space

75 µm traces / 100 µm spacing

Min. BGA Pitch

350 µm

Min. Via

150 µm

Min. Dielectric Layer Thickness

10.0 µm

Min. Conductive Layer Thickness

1.18 µm

Conductivity (Relative to Copper)

)30% ±5%

Dielectric Constant (Dk) @ 2 GHz/15 GHz

2.77 / 2.78

Tangential Loss (Df) @ 2 GHz/15 GHz

0.015 / 0.018


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  • Once an initial Master Production Schedule (MPS) has been created, data can be displayed as stock profile graphs and capacity usage graphs. The MPS can be changed by simply clicking and dragging a point on the stock or capacity graphs, and the production of a particular item can be moved from one planning period to another. Any changes made will be reflected in all the linked plot and grid windows.

  • In a make-to-order environment, stock levels of finished and intermediate items will not be part of the key process parameters. But there will still be the need to evaluate the effects of future demand changes on the manufacturing process. When a change in demand occurs, whether in terms of quantity or delivery dates, there is a need to be able to quickly assess if it is possible to meet the new requirements.

  • Generate accurate and achievable master production schedules (MPS) considering rough cut capacity, pack forward figures, target days of stock cover, manufacturing preferences, minimum and maximum re-order quantities, re-order multiples and product shelf life. Production capacity can be specified as a quantity, duration or weight. By using the Preactor calendar system capacity, production capacity can be varied over time. The capacity available then limits the production volume created in each period.


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